TSMC and three other semiconductor companies agree to invest in Dresden fabrication facility
Companies including the world’s largest contract semiconductor manufacturer are teaming up to build a new chip plant in Germany, with the help of public subsidies intended to help the EU gain a bigger share of the microchip industry.
On 8 August, the Taiwan Semiconductor Manufacturing Company, Germany-based Bosch and Infineon, and Netherlands-based NXP Semiconductors announced that they plan to invest in a Dresden fabrication facility partly funded by the German government.
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